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CYW15G0403DXB-BGC123
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CYW15G0403DXB-BGC
  • Manufacturer No:
    CYW15G0403DXB-BGC
  • Manufacturer:
    Cypress Semiconductor Corp
  • Category:
    Interface - Telecom
  • Datasheet:
    CYW15G0403DXB-BGC
  • SKU:
    3794395
  • Description:
    e0 CY*15G04 Tray HOTlink II™ interface telecom 3.135V~3.465V 1.27A 27mm 1500000Mbps

CYW15G0403DXB-BGC Details

e0 CY*15G04 Tray HOTlink II™ interface telecom 3.135V~3.465V 1.27A 27mm 1500000Mbps

CYW15G0403DXB-BGC Specification Parameters

  • Mounting Type: Surface Mount
  • Number of Functions: 1
  • Part Status: Obsolete
  • Number of Transceivers: 4
  • Power Supplies: 3.3V
  • Temperature Grade: COMMERCIAL
  • JESD-609 Code: e0
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • Terminal Position: BOTTOM
  • Min Operating Temperature: 0°C
  • Number of Terminations: 256
  • Peak Reflow Temperature (Cel): 225
  • Length: 27mm
  • Telecom IC Type: TELECOM CIRCUIT
  • Subcategory: Network Interfaces
  • Series: HOTlink II?
  • Base Part Number: CY*15G04
  • Mount: Surface Mount
  • RoHS Status: Non-RoHS Compliant
  • Number of Circuits: 4
  • Supply Voltage: 3.3V
  • Packaging: Tray
  • Qualification Status: Not Qualified
  • Published: 2012
  • Max Operating Temperature: 70°C
  • Reach Compliance Code: not_compliant
  • Terminal Pitch: 1.27mm
  • Technology: BICMOS
  • Terminal Form: BALL
  • Pin Count: 256
  • Voltage - Supply: 3.135V~3.465V
  • Width: 27mm
  • JESD-30 Code: S-PBGA-B256
  • Nominal Supply Current: 1.27A
  • Package / Case: 256-LBGA Exposed Pad
  • Data Rate: 1500000 Mbps

Cypress Semiconductor Corp — Manufacturer Introduction

Cypress Semiconductor Corp
Cypress targets innovative markets growing faster than the overall semiconductor industry, including key segments of the automotive, industrial, home automation and appliances, medical products and consumer electronics businesses. With the help of Digi-Key Electronics, we supply customers with market-leading solutions based on our MCUs, wireless SoCs, memories, analog ICs and USB controllers. Our world-class wireless technology gives us an unparalleled position in the fast-growing Internet of Things, a business that cuts across our conventional markets and gives us a stake in exciting, next-generation segments such as connected and autonomous cars.

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