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- Manufacturer No：214-3339-19-0602J
- Manufacturer：
- Category：Sockets for ICs, Transistors - Adapters
- Datasheet：
Get the PDF file - SKU：2056331
- Description：RECEPTACLE DIP SOCKET 14POS .3"
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- Manufacturer No：214-3339-19-0602J
- Manufacturer：3M
- Category：Sockets for ICs, Transistors - Adapters
- Datasheet：214-3339-19-0602J
- SKU：2056331
- Description：RECEPTACLE DIP SOCKET 14POS .3"
User Guide
User Guide
214-3339-19-0602J Details
RECEPTACLE DIP SOCKET 14POS .3"
214-3339-19-0602J Specification Parameters
- Part Status: Active
- Number of Rows: 2
- RoHS Status: RoHS Compliant
- Contact Plating: Gold
- Lead Free: Lead Free
- Min Operating Temperature: -55°C
- Flammability Rating: UL94 V-0
- Pitch - Post: 0.100 2.54mm
- Factory Lead Time: 8 Weeks
- Contact Finish Thickness - Mating: 30.0μin 0.76μm
- Published: 2011
- Max Operating Temperature: 150°C
- Number of Pins: 14
- Current Rating: 1A
- Contact Material - Mating: Beryllium Copper
- Contact Material: Copper
- Mount: Wire
- Convert To (Adapter End): DIP, 0.3 (7.62mm) Row Spacing
- Termination Post Length: 0.620 15.75mm
- Row Spacing: 7.62 mm
- Housing Material: Polysulfone (PSU), Glass Filled
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mounting Type: Through Hole
- Contact Finish - Mating: Gold
- Contact Finish - Post: Gold
- Operating Temperature: -55°C~125°C
- Material Flammability Rating: UL94 V-0
- Pitch - Mating: 0.100 2.54mm
- Gender: Female
- Pitch: 2.54mm
- Contact Finish Thickness - Post: 30.0μin 0.76μm
- Orientation: Straight
- Number of Positions: 14
- Number of Contacts: 14
- Current Rating (Amps): 1A
- Contact Material - Post: Beryllium Copper
- Termination: Wire Wrap
- Feature: Closed Frame
- Convert From (Adapter End): DIP, 0.3 (7.62mm) Row Spacing
- Weight: 453.59237g
- Series: Textool?
- Body Material: Glass, Polysulfone
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3M — Manufacturer Introduction
3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M? Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak? High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX? and SLA modeling - 3M's experienced engineers turn ideas into real world solutions. 3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool? Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
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