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MC68EN360CZP25L123
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MC68EN360CZP25L
  • Manufacturer No:
    MC68EN360CZP25L
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Embedded - Microprocessors
  • Datasheet:
    MC68EN360CZP25L
  • SKU:
    10919401
  • Description:
    Contains Lead MICROCONTROLLER RISC Not Qualified BALL IC Microprocessor 85C 25mm 4.75V 25MHz

MC68EN360CZP25L Details

Contains Lead MICROCONTROLLER RISC Not Qualified BALL IC Microprocessor 85C 25mm 4.75V 25MHz

MC68EN360CZP25L Specification Parameters

  • DAC Channels: NO
  • PWM Channels: NO
  • ECCN Code: EAR99
  • Surface Mount: YES
  • Supply Voltage: 5V
  • Lead Free: Contains Lead
  • Min Operating Temperature: -40°C
  • Max Operating Temperature: 85°C
  • Reach Compliance Code: not_compliant
  • External Data Bus Width: 32
  • Temperature Grade: INDUSTRIAL
  • Terminal Form: BALL
  • uPs/uCs/Peripheral ICs Type: MICROCONTROLLER, RISC
  • Width: 25mm
  • Technology: HCMOS
  • Peak Reflow Temperature (Cel): 220
  • Halogen Free: Not Halogen Free
  • Pin Count: 357
  • Has ADC: NO
  • Number of Cores: 1
  • RoHS Status: Non-RoHS Compliant
  • DMA Channels: YES
  • Moisture Sensitivity Level (MSL): 3
  • Qualification Status: Not Qualified
  • JESD-609 Code: e0
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • Address Bus Width: 32
  • Terminal Position: BOTTOM
  • Frequency: 25MHz
  • Length: 25mm
  • Supply Voltage-Max (Vsup): 5.25V
  • Supply Voltage-Min (Vsup): 4.75V
  • Package / Case: BGA
  • Number of Terminations: 357

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor, Inc. (NXP Semiconductors)
Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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