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MPC8535EBVTAQG123
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MPC8535EBVTAQG
  • Manufacturer No:
    MPC8535EBVTAQG
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Embedded - Microprocessors
  • Datasheet:
    MPC8535EBVTAQG
  • SKU:
    10904469
  • Description:

MPC8535EBVTAQG Details

MPC8535EBVTAQG Specification Parameters

  • RoHS Status: RoHS Compliant
  • Surface Mount: YES
  • Boundary Scan: YES
  • Operating Supply Voltage: 3.3V
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 40
  • Bit Size: 32
  • Terminal Pitch: 1mm
  • Min Operating Temperature: 0°C
  • Supply Voltage: 1V
  • HTS Code: 8542.31.00.01
  • Temperature Grade: OTHER
  • Length: 29mm
  • Terminal Finish: Tin/Silver (Sn/Ag)
  • Supply Voltage-Max (Vsup): 1.05V
  • Interface: I2C, SPI, UART
  • Package / Case: FCBGA
  • Number of Terminations: 783
  • Pin Count: 783
  • Speed: 1000 MHz
  • Radiation Hardening: No
  • Low Power Mode: YES
  • Integrated Cache: YES
  • Moisture Sensitivity Level (MSL): 3
  • Peak Reflow Temperature (Cel): 260
  • Max Operating Temperature: 105°C
  • Address Bus Width: 32
  • Terminal Position: BOTTOM
  • Terminal Form: BALL
  • Halogen Free: Halogen Free
  • JESD-609 Code: e2
  • Data Bus Width: 32b
  • Frequency (Max): 1GHz
  • Subcategory: Microprocessors
  • Height Seated (Max): 2.76mm
  • Format: FLOATING POINT
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR
  • Number of Pins: 783
  • ECCN Code: 5A002
  • Weight: 3.695587g

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor, Inc. (NXP Semiconductors)
Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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