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A3P400-PQ208I123
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A3P400-PQ208I
  • Manufacturer No:
    A3P400-PQ208I
  • Manufacturer:
    Microsemi Corporation
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    A3P400-PQ208I
  • SKU:
    11274349
  • Description:
    ProASIC3 A3P400 208-BFQFP Tin/Lead (Sn/Pb) field programmable gate array 3.4mm 1.5V 231MHz 6.8kB

A3P400-PQ208I Details

ProASIC3 A3P400 208-BFQFP Tin/Lead (Sn/Pb) field programmable gate array 3.4mm 1.5V 231MHz 6.8kB

A3P400-PQ208I Specification Parameters

  • Mounting Type: Surface Mount
  • Radiation Hardening: No
  • Part Status: Obsolete
  • JESD-609 Code: e0
  • Technology: CMOS
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • Terminal Pitch: 0.5mm
  • HTS Code: 8542.39.00.01
  • Supply Voltage: 1.5V
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Length: 28mm
  • Height: 3.4mm
  • Number of Terminations: 208
  • Voltage - Supply: 1.425V~1.575V
  • Package / Case: 208-BFQFP
  • Series: ProASIC3
  • Number of Gates: 400000
  • RAM Size: 6.8kB
  • Base Part Number: A3P400
  • Mount: Surface Mount
  • RoHS Status: Non-RoHS Compliant
  • Packaging: Tray
  • Terminal Form: GULL WING
  • Contact Plating: Lead, Tin
  • Time@Peak Reflow Temperature-Max (s): 30
  • Published: 2009
  • Terminal Position: QUAD
  • Factory Lead Time: 20 Weeks
  • Operating Supply Voltage: 1.5V
  • Peak Reflow Temperature (Cel): 225
  • Width: 28mm
  • Operating Temperature: -40°C~100°C TJ
  • Number of Pins: 208
  • Lifecycle Status: OBSOLETE (Last Updated: 1 month ago)
  • Number of I/O: 151
  • Total RAM Bits: 55296
  • Frequency: 231MHz
  • Number of Registers: 9216

Microsemi Corporation — Manufacturer Introduction

Microsemi Corporation
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

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