BSP250,135
Nexperia USA Inc.
Part Status
ActiveRoHS Status
ROHS3 CompliantMoisture Sensitivity Level (MSL)
1 (Unlimited)Mounting Type
Surface MountPackaging
Tape & Reel (TR)Number of Elements
1ECCN Code
EAR99Radiation Hardening
NoSurface Mount
YESJESD-609 Code
e3Lead Free
Lead FreeContact Plating
TinTerminal Position
DUALNumber of Pins
4Number of Terminations
4Pin Count
4Drain Current-Max (Abs) (ID)
3AContinuous Drain Current (ID)
3ATerminal Form
GULL WINGPeak Reflow Temperature (Cel)
260Factory Lead Time
4 WeeksTime@Peak Reflow Temperature-Max (s)
30Drive Voltage (Max Rds On,Min Rds On)
10VTransistor Element Material
SILICONGate to Source Voltage (Vgs)
20VDrain to Source Breakdown Voltage
30VTechnology
MOSFET (Metal Oxide)Pulsed Drain Current-Max (IDM)
12ATransistor Application
SWITCHINGOperating Mode
ENHANCEMENT MODEVgs (Max)
±20VPublished
1998Operating Temperature
150°C TJConfiguration
SINGLE WITH BUILT-IN DIODECase Connection
DRAINFET Type
P-ChannelPackage / Case
TO-261-4, TO-261AAResistance
250mOhmMax Dual Supply Voltage
-30VGate Charge (Qg) (Max) @ Vgs
25nC @ 10VPower Dissipation
1.65WCurrent - Continuous Drain (Id) @ 25°C
3A TcVgs(th) (Max) @ Id
2.8V @ 1mARds On (Max) @ Id, Vgs
250m Ω @ 1A, 10VInput Capacitance (Ciss) (Max) @ Vds
250pF @ 20VPower Dissipation-Max
1.65W Ta