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  • Manufacturer No:
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
  • SKU:
  • Description:
    PICK & PLACE PAD Rectangular Connector Header

BKT-143-03-F-V-P Details

PICK & PLACE PAD Rectangular Connector Header

BKT-143-03-F-V-P Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Number Of PCB Rows: 2
  • Pbfree Code: yes
  • Contact Finish - Mating: Gold
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Material Flammability Rating: UL94 V-0
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Reliability: COMMERCIAL
  • Number of Conductors: ONE
  • Shrouding: Unshrouded
  • Connector Type: Header
  • Contact Finish Thickness - Mating: 3.00μin 0.076μm
  • Stack Height (Mating): 5mm
  • Pitch - Mating: 0.039 1.00mm
  • Mounting Option 1: LOCKING
  • Feature: Pick and Place
  • Total Number of Contacts: 43
  • Current Rating (Amps): 2.8A per Contact
  • Terminal Pitch: 0.9906mm
  • Body Depth: 0.11 inch
  • Mating Contact Pitch: 0.019 inch
  • RoHS Status: ROHS3 Compliant
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • JESD-609 Code: e3
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Packaging: Tube
  • Contact Type: Male Pin
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Row Spacing - Mating: 0.100 (2.54mm)
  • Reference Standard: UL
  • Style: Board to Board
  • Insulation Height: 0.098 2.50mm
  • Polarization Key: POLARIZED HOUSING
  • PCB Contact Pattern: STAGGERED
  • Number of Positions: 43
  • Contact Length - Mating: 0.065 1.65mm
  • Plating Thickness: 3μin
  • Series: BKT
  • Additional Feature: PICK & PLACE PAD
  • Body Length or Diameter: 0.876 inch

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.


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