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CLH-104-L-D-DV-TR123
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CLH-104-L-D-DV-TR
  • Manufacturer No:
    CLH-104-L-D-DV-TR
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Receptacles, Female Sockets
  • Datasheet:
    CLH-104-L-D-DV-TR
  • SKU:
    2664197
  • Description:
    SAMTEC CLH-104-L-D-DV-TR Board-To-Board Connector, CLH Series, 8 Contacts, Receptacle, 2.54 mm, Surface Mount, 2 Rows

CLH-104-L-D-DV-TR Details

SAMTEC CLH-104-L-D-DV-TR Board-To-Board Connector, CLH Series, 8 Contacts, Receptacle, 2.54 mm, Surface Mount, 2 Rows

CLH-104-L-D-DV-TR Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Number Of PCB Rows: 2
  • Packaging: Tape & Reel (TR)
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Insulator Color: Black
  • Option: GENERAL PURPOSE
  • Reliability: COMMERCIAL
  • Pitch: 2.54mm
  • PCB Contact Pattern: RECTANGULAR
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature (Min): -65°C
  • Gender: Receptacle
  • Reference Standard: UL
  • Plating Thickness: 10μin
  • Contact Resistance: 10mOhm
  • Rated Current (Signal): 1.5A
  • Additional Feature: TAPE AND REEL
  • Body/Shell Style: SOCKET
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • Radiation Hardening: No
  • Contact Plating: Gold
  • Termination: Solder
  • Number of Contacts: 8
  • Number of Conductors: ONE
  • REACH SVHC: No SVHC
  • Contact Pattern: RECTANGULAR
  • Mating Information: MULTIPLE MATING PARTS AVAILABLE
  • Subcategory: Headers and Edge Type Connectors
  • Published: 2011
  • Mating Contact Row Spacing: 0.1 inch
  • Connector Type: BOARD CONNECTOR
  • Contact Material: Bronze
  • Contact Style: SQ PIN-SKT
  • Durability: 100 Cycles

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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