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  • Manufacturer No:
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Receptacles, Female Sockets
  • Datasheet:
  • SKU:
  • Description:
    Rectangular Connector Header

CLH-136-L-D-DV-A Details

Rectangular Connector Header

CLH-136-L-D-DV-A Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Number Of PCB Rows: 2
  • Pbfree Code: yes
  • Contact Plating: Gold
  • Termination: Solder
  • Gender: Female
  • Reliability: COMMERCIAL
  • Pitch: 2.54mm
  • Contact Pattern: RECTANGULAR
  • Subcategory: Headers and Edge Type Connectors
  • Reference Standard: UL
  • Mating Contact Row Spacing: 0.1 inch
  • Connector Type: BOARD CONNECTOR
  • Rated Current (Signal): 1.5A
  • Mounting Type: BOARD
  • Mounting Style: STRAIGHT
  • Body/Shell Style: SOCKET
  • Body Depth: 0.14 inch
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • ECCN Code: EAR99
  • JESD-609 Code: e3
  • Insulator Color: Black
  • Contact Material: Phosphor Bronze
  • Number of Conductors: ONE
  • PCB Contact Pattern: RECTANGULAR
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature (Min): -65°C
  • HTS Code: 8536.69.40.40
  • Reach Compliance Code: not_compliant
  • Plating Thickness: 10μin
  • Contact Resistance: 10mOhm
  • Contact Style: SQ PIN-SKT
  • Number of Contacts: 72
  • Durability: 100 Cycles
  • Board Mounting Option: POSITIONING PIN
  • Body Length or Diameter: 3.6 inch

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.


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