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DW-02-10-T-S-595123
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DW-02-10-T-S-595
  • Manufacturer No:
    DW-02-10-T-S-595
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Board Spacers, Stackers (Board to Board)
  • Datasheet:
    DW-02-10-T-S-595
  • SKU:
    2663926
  • Description:
    Conn Board Stacker HDR 2 POS 2.54mm Solder ST Thru-Hole

DW-02-10-T-S-595 Details

Conn Board Stacker HDR 2 POS 2.54mm Solder ST Thru-Hole

DW-02-10-T-S-595 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Total Number of Contacts: 2
  • Mounting Type: Through Hole
  • Number of Rows: 1
  • Radiation Hardening: No
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Termination: Solder
  • Contact Finish - Post (Mating): Tin
  • Pitch: 0.100 2.54mm
  • Contact Material: Phosphor Bronze
  • Length - Tail: 0.110 2.794mm
  • Length - Overall Pin: 0.830 21.082mm
  • Length - Stack Height: 0.595 15.113mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Positions: 2
  • Packaging: Bulk
  • Mount: Through Hole
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Color: Black
  • Factory Lead Time: 3 Weeks
  • Option: GENERAL PURPOSE
  • Gender: Male
  • Connector Type: BOARD STACKING CONNECTOR
  • Series: Flex Stack, DW
  • Length - Post (Mating): 0.125 3.175mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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