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DW-17-12-S-Q-200123
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DW-17-12-S-Q-200
  • Manufacturer No:
    DW-17-12-S-Q-200
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Board Spacers, Stackers (Board to Board)
  • Datasheet:
    DW-17-12-S-Q-200
  • SKU:
    2664158
  • Description:
    Flex Stack DW ROHS3Compliant GENERAL PURPOSE MULTIPLE MATING PARTS AVAILABLE Spacer Connector 1.030 26.162mm

DW-17-12-S-Q-200 Details

Flex Stack DW ROHS3Compliant GENERAL PURPOSE MULTIPLE MATING PARTS AVAILABLE Spacer Connector 1.030 26.162mm

DW-17-12-S-Q-200 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Through Hole
  • ECCN Code: EAR99
  • Radiation Hardening: No
  • Contact Finish - Post (Mating): Gold
  • Color: Black
  • Factory Lead Time: 3 Weeks
  • Pitch: 0.100 2.54mm
  • Contact Material: Phosphor Bronze
  • Mating Information: MULTIPLE MATING PARTS AVAILABLE
  • UL Flammability Code: 94V-0
  • Connector Type: BOARD STACKING CONNECTOR
  • Series: Flex Stack, DW
  • Total Number of Contacts: 34
  • Length - Overall Pin: 1.030 26.162mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Packaging: Bulk
  • Mount: Through Hole
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Termination: Solder
  • Option: GENERAL PURPOSE
  • Gender: Male
  • Number of Rows: 3
  • Contact Finish Thickness - Post (Mating): 30.0μin 0.76μm
  • Row Spacing: 0.100 (2.54mm)
  • Length - Tail: 0.110 2.794mm
  • Number of Positions: 34
  • Length - Stack Height: 0.200 5.080mm
  • Length - Post (Mating): 0.720 18.288mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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