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DW-18-11-F-S-660123
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DW-18-11-F-S-660
  • Manufacturer No:
    DW-18-11-F-S-660
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Board Spacers, Stackers (Board to Board)
  • Datasheet:
    DW-18-11-F-S-660
  • SKU:
    2664109
  • Description:
    Rectangular Connector Board Spacer

DW-18-11-F-S-660 Details

Rectangular Connector Board Spacer

DW-18-11-F-S-660 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Through Hole
  • Pbfree Code: yes
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Termination: Solder
  • Option: GENERAL PURPOSE
  • Contact Gender: Male
  • UL Flammability Code: 94V-0
  • Connector Type: BOARD STACKING CONNECTOR
  • Total Number of Contacts: 18
  • Series: Flex Stack, DW
  • Length - Post (Mating): 0.160 4.064mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Packaging: Bulk
  • Number of Rows: 1
  • Contact Finish - Post (Mating): Gold
  • Color: Black
  • Factory Lead Time: 3 Weeks
  • Pitch: 0.100 2.54mm
  • Mating Information: MULTIPLE MATING PARTS AVAILABLE
  • Contact Finish Thickness - Post (Mating): 3.00μin 0.076μm
  • Number of Positions: 18
  • Length - Tail: 0.110 2.794mm
  • Length - Overall Pin: 0.930 23.622mm
  • Length - Stack Height: 0.660 16.764mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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