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  • Manufacturer No:
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
  • SKU:
  • Description:
    EJH ROHS3Compliant COMMERCIAL UL Connector Header -55C~125C 3A 0.5inch

EJH-120-01-F-D-SM-28 Details

EJH ROHS3Compliant COMMERCIAL UL Connector Header -55C~125C 3A 0.5inch

EJH-120-01-F-D-SM-28 Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Number Of PCB Rows: 2
  • ECCN Code: EAR99
  • JESD-609 Code: e3
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Contact Material: Phosphor Bronze
  • Packaging: Tube
  • Current Rating (Amps): 3A
  • Number of Conductors: ONE
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Connector Type: Header
  • Number of Positions: 40
  • Contact Finish Thickness - Mating: 3.00μin 0.076μm
  • Shrouding: Shrouded - 4 Wall
  • Number of Positions Loaded: 39
  • Plating Thickness: FLASH inch
  • Contact Length - Mating: 0.225 5.72mm
  • Body Depth: 0.5 inch
  • Mounting Option 1: LATCH & EJECT
  • Mounting Option 2: LATCHING
  • RoHS Status: ROHS3 Compliant
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Pbfree Code: yes
  • Contact Finish - Mating: Gold
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Pitch - Mating: 0.100 2.54mm
  • Contact Shape: Square
  • Reliability: COMMERCIAL
  • Contact Type: Male Pin
  • PCB Contact Pattern: RECTANGULAR
  • Row Spacing - Mating: 0.100 (2.54mm)
  • Reference Standard: UL
  • Total Number of Contacts: 40
  • Mating Contact Pitch: 0.1 inch
  • Style: Board to Cable/Wire
  • Insulation Height: 0.500 12.70mm
  • Feature: Keying Slot
  • Fastening Type: Latch Lock/Eject Hooks
  • Polarization Key: CTR W/GUIDE SLOTS
  • Series: EJH

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.


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