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ESQT-106-02-F-D-685123
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ESQT-106-02-F-D-685
  • Manufacturer No:
    ESQT-106-02-F-D-685
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Receptacles, Female Sockets
  • Datasheet:
    ESQT-106-02-F-D-685
  • SKU:
    2663994
  • Description:
    CONN SOCKET 12POS 0.079 GOLD PCB

ESQT-106-02-F-D-685 Details

CONN SOCKET 12POS 0.079 GOLD PCB

ESQT-106-02-F-D-685 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Number of Rows: 2
  • Mounting Type: Through Hole
  • JESD-609 Code: e3
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Material Flammability Rating: UL94 V-0
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • UL Flammability Code: 94V-0
  • Pitch - Mating: 0.079 2.00mm
  • Number of Positions: 12
  • Contact Type: Forked
  • Current Rating (Amps): 4.5A per Contact
  • Contact Length - Post: 0.165 4.19mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Packaging: Bulk
  • ECCN Code: EAR99
  • Contact Finish - Mating: Gold
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Option: GENERAL PURPOSE
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Style: Board to Board or Cable
  • Gender: Receptacle
  • HTS Code: 8536.69.40.40
  • Contact Finish Thickness - Mating: 3.00μin 0.076μm
  • Row Spacing - Mating: 0.079 (2.00mm)
  • Connector Type: Elevated Socket
  • Series: ESQT
  • Insulation Height: 0.685 17.40mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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