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ESQT-110-02-F-S-420123
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ESQT-110-02-F-S-420
  • Manufacturer No:
    ESQT-110-02-F-S-420
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Receptacles, Female Sockets
  • Datasheet:
    ESQT-110-02-F-S-420
  • SKU:
    2664243
  • Description:
    Rectangular Connector Header

ESQT-110-02-F-S-420 Details

Rectangular Connector Header

ESQT-110-02-F-S-420 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Through Hole
  • Contact Finish - Mating: Gold
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Material Flammability Rating: UL94 V-0
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Style: Board to Board or Cable
  • UL Flammability Code: 94V-0
  • Pitch - Mating: 0.079 2.00mm
  • Terminal Pitch: 2mm
  • Connector Type: Elevated Socket
  • Current Rating (Amps): 4.5A per Contact
  • Insulation Height: 0.420 10.67mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Packaging: Bulk
  • Number of Rows: 1
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Option: GENERAL PURPOSE
  • Contact Gender: Female
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Number of Positions: 10
  • Contact Finish Thickness - Mating: 3.00μin 0.076μm
  • Contact Type: Forked
  • Contact Length - Post: 0.430 10.92mm
  • Series: ESQT

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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