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  • Manufacturer No:
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Receptacles, Female Sockets
  • Datasheet:
  • SKU:
  • Description:
    Conn Elevated Socket SKT 120 POS 2mm Solder ST Thru-Hole

ESQT-130-03-M-Q-367 Details

Conn Elevated Socket SKT 120 POS 2mm Solder ST Thru-Hole

ESQT-130-03-M-Q-367 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Through Hole
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Gender: Female
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Published: 2016
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Terminal Pitch: 2mm
  • Contact Type: Forked
  • Connector Type: Elevated Socket
  • Series: ESQT
  • Additional Feature: FLEXYZ; TIGER BUY
  • Insulation Height: 0.367 9.33mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Packaging: Bulk
  • Mount: Through Hole
  • Radiation Hardening: No
  • Contact Finish - Mating: Gold
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Material Flammability Rating: UL94 V-0
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Number of Rows: 4
  • Style: Board to Board or Cable
  • Pitch - Mating: 0.079 2.00mm
  • Row Spacing - Mating: 0.079 (2.00mm)
  • Contact Finish Thickness - Mating: 20.0μin 0.51μm
  • Current Rating (Amps): 4.5A per Contact
  • Number of Positions: 120
  • Contact Length - Post: 0.091 2.30mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.


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Based on reviews

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