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ESW-132-34-S-S-LL123
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ESW-132-34-S-S-LL
  • Manufacturer No:
    ESW-132-34-S-S-LL
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Receptacles, Female Sockets
  • Datasheet:
    ESW-132-34-S-S-LL
  • SKU:
    2664195
  • Description:
    Rectangular Connector Header

ESW-132-34-S-S-LL Details

Rectangular Connector Header

ESW-132-34-S-S-LL Specification Parameters

  • Part Status: Active
  • Packaging: Bulk
  • Number of Rows: 1
  • ECCN Code: EAR99
  • JESD-609 Code: e3
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Pitch - Mating: 0.100 2.54mm
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Reliability: COMMERCIAL
  • Terminal Pitch: 2.54mm
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Contact Finish Thickness - Mating: 30.0μin 0.76μm
  • Style: Board to Board
  • Plating Thickness: 30μin
  • Contact Type: Forked
  • Current Rating (Amps): 5.2A per Contact
  • Voltage - Rated: 550VAC
  • Series: ESW
  • Insulation Height: 0.635 16.13mm
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Through Hole
  • Number Of PCB Rows: 1
  • Pbfree Code: yes
  • Contact Finish - Mating: Gold
  • Insulation Color: Black
  • Factory Lead Time: 3 Weeks
  • Material Flammability Rating: UL94 V-0
  • Contact Gender: Female
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Number of Conductors: ONE
  • PCB Contact Pattern: RECTANGULAR
  • Subcategory: Headers and Edge Type Connectors
  • HTS Code: 8536.69.40.40
  • Number of Positions: 32
  • Reference Standard: UL, CSA
  • Connector Type: Elevated Socket
  • Termination: Kinked Pin, Solder
  • Body Breadth: 0.095 inch
  • Contact Length - Post: 0.280 7.11mm
  • Body Depth: 0.635 inch

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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