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EW-07-10-G-D-307123
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EW-07-10-G-D-307
  • Manufacturer No:
    EW-07-10-G-D-307
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Board Spacers, Stackers (Board to Board)
  • Datasheet:
    EW-07-10-G-D-307
  • SKU:
    2663989
  • Description:
    CONN HDR 14POS 0.1 STACK T/H

EW-07-10-G-D-307 Details

CONN HDR 14POS 0.1 STACK T/H

EW-07-10-G-D-307 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • ECCN Code: EAR99
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Termination: Solder
  • Pitch: 0.100 2.54mm
  • JESD-609 Code: e4
  • Contact Finish Thickness - Post (Mating): 10.0μin 0.25μm
  • Row Spacing: 0.100 (2.54mm)
  • Connector Type: BOARD STACKING CONNECTOR
  • Total Number of Contacts: 14
  • Length - Overall Pin: 0.830 21.082mm
  • Length - Post (Mating): 0.193 4.902mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Mounting Type: Through Hole
  • Contact Finish - Post (Mating): Gold
  • Color: Black
  • Option: GENERAL PURPOSE
  • Contact Gender: Male
  • Factory Lead Time: 6 Weeks
  • UL Flammability Code: 94V-0
  • HTS Code: 8536.69.40.40
  • Number of Positions: 14
  • Length - Tail: 0.330 8.382mm
  • Series: Flex Stack, EW
  • Length - Stack Height: 0.307 7.798mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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