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EW-10-09-T-D-285123
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EW-10-09-T-D-285
  • Manufacturer No:
    EW-10-09-T-D-285
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Board Spacers, Stackers (Board to Board)
  • Datasheet:
    EW-10-09-T-D-285
  • SKU:
    2664173
  • Description:
    Rectangular Connector Stacker

EW-10-09-T-D-285 Details

Rectangular Connector Stacker

EW-10-09-T-D-285 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • Mount: Through Hole
  • JESD-609 Code: e3
  • Color: Black
  • Factory Lead Time: 3 Weeks
  • Option: GENERAL PURPOSE
  • Gender: Male
  • Published: 2016
  • Total Number of Contacts: 20
  • Row Spacing: 0.100 (2.54mm)
  • Length - Tail: 0.330 8.382mm
  • Series: Flex Stack, EW
  • Length - Post (Mating): 0.115 2.921mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Mounting Type: Through Hole
  • Pbfree Code: yes
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Termination: Solder
  • Contact Finish - Post (Mating): Tin
  • Pitch: 0.100 2.54mm
  • Contact Material: Phosphor Bronze
  • Number of Positions: 20
  • UL Flammability Code: 94V-0
  • Connector Type: BOARD STACKING CONNECTOR
  • Length - Overall Pin: 0.730 18.542mm
  • Length - Stack Height: 0.285 7.239mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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