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  • Manufacturer No:
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Board Spacers, Stackers (Board to Board)
  • Datasheet:
  • SKU:
  • Description:
    Flex Stack EW ROHS3Compliant 2016 GENERAL PURPOSE Spacer Connector 0.730 18.542mm

EW-18-09-L-D-300 Details

Flex Stack EW ROHS3Compliant 2016 GENERAL PURPOSE Spacer Connector 0.730 18.542mm

EW-18-09-L-D-300 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • Mount: Through Hole
  • JESD-609 Code: e3
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Termination: Solder
  • Gender: Male
  • Published: 2016
  • Row Spacing: 0.100 (2.54mm)
  • Number of Positions: 36
  • Length - Post (Mating): 0.100 2.540mm
  • Length - Overall Pin: 0.730 18.542mm
  • Length - Stack Height: 0.300 7.620mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Mounting Type: Through Hole
  • Pbfree Code: yes
  • Contact Finish - Post (Mating): Gold
  • Color: Black
  • Factory Lead Time: 3 Weeks
  • Pitch: 0.100 2.54mm
  • Contact Material: Phosphor Bronze
  • Contact Finish Thickness - Post (Mating): 10.0μin 0.25μm
  • Total Number of Contacts: 36
  • Length - Tail: 0.330 8.382mm
  • Series: Flex Stack, EW

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.


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