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FTR-133-53-G-D-LC123
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FTR-133-53-G-D-LC
  • Manufacturer No:
    FTR-133-53-G-D-LC
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
    FTR-133-53-G-D-LC
  • SKU:
    2664226
  • Description:
    Rectangular Connector Header

FTR-133-53-G-D-LC Details

Rectangular Connector Header

FTR-133-53-G-D-LC Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Surface Mount
  • Pbfree Code: yes
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Option: GENERAL PURPOSE
  • Insulation Height: 0.100 2.54mm
  • JESD-609 Code: e4
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Contact Type: Male Pin
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Shrouding: Unshrouded
  • HTS Code: 8536.69.40.40
  • Contact Finish Thickness - Post: 3.00μin 0.076μm
  • Style: Board to Board
  • Number of Positions: 66
  • Current Rating (Amps): 3.1A per Contact
  • Contact Length - Mating: 0.285 7.24mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • ECCN Code: EAR99
  • Contact Finish - Mating: Gold
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Material Flammability Rating: UL94 V-0
  • Gender: Male
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Packaging: Tube
  • Contact Finish Thickness - Mating: 10.0μin 0.25μm
  • UL Flammability Code: 94V-0
  • Row Spacing - Mating: 0.100 (2.54mm)
  • Connector Type: Header
  • Pitch - Mating: 0.050 1.27mm
  • Feature: Board Lock
  • Total Number of Contacts: 66
  • Series: FTR

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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