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FTSH-116-05-F-DV-A123
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FTSH-116-05-F-DV-A
  • Manufacturer No:
    FTSH-116-05-F-DV-A
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
    FTSH-116-05-F-DV-A
  • SKU:
    2663871
  • Description:
    Rectangular Connector Header

FTSH-116-05-F-DV-A Details

Rectangular Connector Header

FTSH-116-05-F-DV-A Specification Parameters

  • Part Status: Active
  • Number of Rows: 2
  • ECCN Code: EAR99
  • Lead Free: Lead Free
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Material Flammability Rating: UL94 V-0
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Contact Type: Male Pin
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • HTS Code: 8536.69.40.40
  • Pitch - Mating: 0.050 1.27mm
  • Connector Type: Header, Cuttable
  • Feature: Board Guide
  • Series: FTSH
  • Contact Length - Mating: 0.170 4.32mm
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Surface Mount
  • Contact Finish - Mating: Gold
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Packaging: Tube
  • Style: Board to Board or Cable
  • Shrouding: Unshrouded
  • Contact Finish Thickness - Mating: 3.00μin 0.076μm
  • Number of Positions: 32
  • Row Spacing - Mating: 0.050 (1.27mm)
  • Current Rating (Amps): 3.4A per Contact
  • Insulation Height: 0.099 2.51mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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