Add to like
Add to project list
FTSH-145-02-L-DV-A-P123
Inventory:0
  • Qty Unit Price price

Not the price you want? Send RFQ Now and we'll contact you ASAP

FTSH-145-02-L-DV-A-P
  • Manufacturer No:
    FTSH-145-02-L-DV-A-P
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
    FTSH-145-02-L-DV-A-P
  • SKU:
    2664002
  • Description:
    Conn Unshrouded Header HDR 90 POS 1.27mm Solder ST SMD Tube

FTSH-145-02-L-DV-A-P Details

Conn Unshrouded Header HDR 90 POS 1.27mm Solder ST SMD Tube

FTSH-145-02-L-DV-A-P Specification Parameters

  • Part Status: Active
  • Number of Rows: 2
  • Radiation Hardening: No
  • Contact Finish - Mating: Gold
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Gender: Male
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Contact Type: Male Pin
  • Style: Board to Board or Cable
  • Shrouding: Unshrouded
  • Connector Type: Header, Cuttable
  • Number of Positions: 90
  • Current Rating (Amps): 3.4A per Contact
  • Series: FTSH
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Surface Mount
  • JESD-609 Code: e3
  • Lead Free: Lead Free
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Material Flammability Rating: UL94 V-0
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Packaging: Tube
  • Contact Finish Thickness - Mating: 10.0μin 0.25μm
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Pitch - Mating: 0.050 1.27mm
  • Row Spacing - Mating: 0.050 (1.27mm)
  • Contact Length - Mating: 0.075 1.90mm
  • Feature: Board Guide, Pick and Place
  • Insulation Height: 0.099 2.51mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

Excellent

Based on reviews

Excellent

Based on reviews

LKR uses cookies to help deliver a better online experience. You can see what cookies we server and how to set your preferences in our Cookies Policy, if you agree on our use of cookies please click continue. When browsing and using our website, LKR also collects, stores and/or processes personal data, please read our Term & Condition and Privacy Policy to find out more.
Our social media
We support logistics
We Accept Payment Via