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  • Manufacturer No:
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
  • SKU:
  • Description:
    Flex Stack HMTSW ROHS3Compliant 2016 GENERAL PURPOSE Connector Header -55C~125C 3A 10.0muin 0.25mum

HMTSW-145-13-L-Q-730 Details

Flex Stack HMTSW ROHS3Compliant 2016 GENERAL PURPOSE Connector Header -55C~125C 3A 10.0muin 0.25mum

HMTSW-145-13-L-Q-730 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • Mount: Through Hole
  • Radiation Hardening: No
  • Contact Finish - Mating: Gold
  • Lead Free: Lead Free
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Material Flammability Rating: UL94 V-0
  • Insulation Height: 0.100 2.54mm
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Current Rating (Amps): 3A
  • Contact Type: Male Pin
  • Lead Pitch: 2.54mm
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Connector Type: Header
  • Number of Positions: 90
  • Row Spacing - Mating: 0.200 (5.08mm)
  • Contact Length - Mating: 0.730 18.54mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Mounting Type: Through Hole
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Pitch - Mating: 0.100 2.54mm
  • Gender: Male
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Published: 2016
  • Contact Finish Thickness - Mating: 10.0μin 0.25μm
  • Style: Board to Board or Cable
  • Shrouding: Unshrouded
  • Insulation Color: Natural
  • Series: Flex Stack, HMTSW
  • Contact Length - Post: 0.400 10.16mm
  • Overall Contact Length: 1.230 31.24mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.


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