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HMTSW-211-11-L-D-100-LA123
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HMTSW-211-11-L-D-100-LA
  • Manufacturer No:
    HMTSW-211-11-L-D-100-LA
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
    HMTSW-211-11-L-D-100-LA
  • SKU:
    2664301
  • Description:
    Flex Stack HMTSW ROHS3Compliant GENERAL PURPOSE Lead Free Connector Header -55C~125C 3A 10.0muin 0.25mum

HMTSW-211-11-L-D-100-LA Details

Flex Stack HMTSW ROHS3Compliant GENERAL PURPOSE Lead Free Connector Header -55C~125C 3A 10.0muin 0.25mum

HMTSW-211-11-L-D-100-LA Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • Mount: Through Hole
  • JESD-609 Code: e3
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Option: GENERAL PURPOSE
  • Insulation Height: 0.100 2.54mm
  • Gender: Male
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Contact Type: Male Pin
  • Style: Board to Board or Cable
  • Shrouding: Unshrouded
  • Connector Type: Header
  • Insulation Color: Natural
  • Number of Positions: 22
  • Contact Length - Post: 0.730 18.54mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Mounting Type: Through Hole
  • Pbfree Code: yes
  • Contact Finish - Mating: Gold
  • Lead Free: Lead Free
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Material Flammability Rating: UL94 V-0
  • Contact Length - Mating: 0.100 2.54mm
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Current Rating (Amps): 3A
  • Contact Finish Thickness - Mating: 10.0μin 0.25μm
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Row Spacing - Mating: 0.100 (2.54mm)
  • Lead Pitch: 5.08mm
  • Pitch - Mating: 0.200 5.08mm
  • Series: Flex Stack, HMTSW
  • Overall Contact Length: 0.930 23.62mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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