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  • Manufacturer No:
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
  • SKU:
  • Description:
    E.L.P. Male Pin Rectangular Connector

HTSW-207-25-T-D-LA Details

E.L.P. Male Pin Rectangular Connector

HTSW-207-25-T-D-LA Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Number Of PCB Rows: 2
  • Mount: Through Hole
  • Pbfree Code: yes
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Contact Finish - Mating: Tin
  • Material Flammability Rating: UL94 V-0
  • Gender: Male
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Published: 2016
  • Number of Conductors: ONE
  • PCB Contact Pattern: RECTANGULAR
  • UL Flammability Code: 94V-0
  • Row Spacing - Mating: 0.100 (2.54mm)
  • Connector Type: Header
  • Mounting Type: Through Hole, Right Angle
  • Length - Termination: 0.1 inch
  • Insulation Color: Natural
  • Pitch - Mating: 0.200 5.08mm
  • Additional Feature: E.L.P.
  • Insulation Height: 0.240 6.10mm
  • Contact Length - Mating: 0.320 8.13mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Packaging: Bulk
  • ECCN Code: EAR99
  • JESD-609 Code: e3
  • Factory Lead Time: 3 Weeks
  • Contact Length - Post: 0.100 2.54mm
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Reliability: COMMERCIAL
  • Contact Type: Male Pin
  • Style: Board to Board or Cable
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Shrouding: Unshrouded
  • HTS Code: 8536.69.40.40
  • Number of Positions: 14
  • Operating Temperature: -55°C~105°C
  • Lead Pitch: 5.08mm
  • Reference Standard: UL, CSA
  • Current Rating (Amps): Varies by WireGAuge
  • Termination: Kinked Pin, Solder
  • Series: HTSW
  • Body Length or Diameter: 1.4 inch

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.


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