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HW-04-09-T-D-375-SM-A123
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HW-04-09-T-D-375-SM-A
  • Manufacturer No:
    HW-04-09-T-D-375-SM-A
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Board Spacers, Stackers (Board to Board)
  • Datasheet:
    HW-04-09-T-D-375-SM-A
  • SKU:
    2663879
  • Description:
    Conn Board Stacker HDR 8 POS 2.54mm Solder ST SMD

HW-04-09-T-D-375-SM-A Details

Conn Board Stacker HDR 8 POS 2.54mm Solder ST SMD

HW-04-09-T-D-375-SM-A Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Color: Black
  • Factory Lead Time: 3 Weeks
  • Option: GENERAL PURPOSE
  • Gender: Male
  • Total Number of Contacts: 8
  • Row Spacing: 0.100 (2.54mm)
  • Series: Flex Stack, HW
  • Length - Overall Pin: 0.665 16.891mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Radiation Hardening: No
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Termination: Solder
  • Contact Finish - Post (Mating): Tin
  • Pitch: 0.100 2.54mm
  • Number of Positions: 8
  • Contact Material: Phosphor Bronze
  • Connector Type: BOARD STACKING CONNECTOR
  • Length - Post (Mating): 0.290 7.366mm
  • Length - Stack Height: 0.375 9.525mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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