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HW-17-20-L-D-375-SM123
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HW-17-20-L-D-375-SM
  • Manufacturer No:
    HW-17-20-L-D-375-SM
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Board Spacers, Stackers (Board to Board)
  • Datasheet:
    HW-17-20-L-D-375-SM
  • SKU:
    2663865
  • Description:
    Flex Stack HW ROHS3Compliant GENERAL PURPOSE Male Spacer Connector 1.065 27.051mm

HW-17-20-L-D-375-SM Details

Flex Stack HW ROHS3Compliant GENERAL PURPOSE Male Spacer Connector 1.065 27.051mm

HW-17-20-L-D-375-SM Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • ECCN Code: EAR99
  • JESD-609 Code: e3
  • Color: Black
  • Factory Lead Time: 3 Weeks
  • Pitch: 0.100 2.54mm
  • Contact Material: Phosphor Bronze
  • Row Spacing: 0.100 (2.54mm)
  • Connector Type: BOARD STACKING CONNECTOR
  • Number of Positions: 34
  • Length - Stack Height: 0.375 9.525mm
  • Length - Post (Mating): 0.690 17.526mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Mounting Type: Surface Mount
  • Pbfree Code: yes
  • Contact Finish - Post (Mating): Gold
  • Termination: Solder
  • Option: GENERAL PURPOSE
  • Gender: Male
  • Contact Finish Thickness - Post (Mating): 10.0μin 0.25μm
  • HTS Code: 8536.69.40.40
  • Series: Flex Stack, HW
  • Total Number of Contacts: 34
  • Length - Overall Pin: 1.065 27.051mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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