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MTMM-108-15-T-D-225123
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MTMM-108-15-T-D-225
  • Manufacturer No:
    MTMM-108-15-T-D-225
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
    MTMM-108-15-T-D-225
  • SKU:
    2664233
  • Description:
    FLEXYZ Rectangular Connector Header

MTMM-108-15-T-D-225 Details

FLEXYZ Rectangular Connector Header

MTMM-108-15-T-D-225 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • Mount: Through Hole
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Insulation Color: Black
  • Factory Lead Time: 3 Weeks
  • Option: GENERAL PURPOSE
  • Gender: Male
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Published: 2016
  • Number of Positions: 16
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • HTS Code: 8536.69.40.40
  • Operating Temperature: -55°C~105°C
  • Row Spacing - Mating: 0.079 (2.00mm)
  • Series: MTMM
  • Overall Contact Length: 0.830 21.08mm
  • Contact Length - Post: 0.546 13.87mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Mounting Type: Through Hole
  • ECCN Code: EAR99
  • Radiation Hardening: No
  • Lead Free: Lead Free
  • Termination: Solder
  • Contact Finish - Mating: Tin
  • Material Flammability Rating: UL94 V-0
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Current Rating (Amps): 3A
  • Contact Type: Male Pin
  • Style: Board to Board or Cable
  • Shrouding: Unshrouded
  • Pitch - Mating: 0.079 2.00mm
  • Connector Type: Header, Cuttable
  • Insulation Height: 0.059 1.50mm
  • Contact Length - Mating: 0.225 5.72mm
  • Additional Feature: FLEXYZ

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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