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MTMM-118-09-S-Q-475123
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MTMM-118-09-S-Q-475
  • Manufacturer No:
    MTMM-118-09-S-Q-475
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
    MTMM-118-09-S-Q-475
  • SKU:
    2663929
  • Description:
    Rectangular Connector Header

MTMM-118-09-S-Q-475 Details

Rectangular Connector Header

MTMM-118-09-S-Q-475 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Through Hole
  • ECCN Code: EAR99
  • Radiation Hardening: No
  • Contact Finish - Mating: Gold
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Option: GENERAL PURPOSE
  • Gender: Male
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Current Rating (Amps): 3A
  • Style: Board to Board or Cable
  • Contact Finish Thickness - Mating: 30.0μin 0.76μm
  • Pitch - Mating: 0.079 2.00mm
  • Connector Type: Header, Cuttable
  • Insulation Height: 0.059 1.50mm
  • Number of Positions: 72
  • Overall Contact Length: 0.535 13.59mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Packaging: Bulk
  • Mount: Through Hole
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Material Flammability Rating: UL94 V-0
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Number of Rows: 4
  • Contact Type: Male Pin
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Shrouding: Unshrouded
  • Terminal Pitch: 2mm
  • Row Spacing - Mating: 0.079 (2.00mm)
  • Series: MTMM
  • Total Number of Contacts: 72
  • Contact Length - Mating: 0.475 12.07mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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