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  • Manufacturer No:
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
  • SKU:
  • Description:

MTSW-101-08-G-T-215 Details


MTSW-101-08-G-T-215 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • Mating Information: NO
  • Packaging: Bulk
  • ECCN Code: EAR99
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Insulation Height: 0.100 2.54mm
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Number of Rows: 3
  • Contact Type: Male Pin
  • Lead Pitch: 2.54mm
  • Shrouding: Unshrouded
  • Contact Finish Thickness - Post: 3.00μin 0.076μm
  • Insulation Material: Polyester, Glass Filled
  • Overall Contact Length: 0.530 13.46mm
  • Contact Length - Post: 0.215 5.46mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Through Hole
  • Contact Finish - Mating: Gold
  • Lead Free: Lead Free
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Material Flammability Rating: UL94 V-0
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Number of Positions: 3
  • Current Rating (Amps): 3A
  • Contact Finish Thickness - Mating: 10.0μin 0.25μm
  • Style: Board to Board or Cable
  • Row Spacing - Mating: 0.100 (2.54mm)
  • Connector Type: Header, Cuttable
  • Series: Flex Stack, MTSW
  • Contact Length - Mating: 0.215 5.46mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.


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Based on reviews

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