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MTSW-114-10-T-Q-100123
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MTSW-114-10-T-Q-100
  • Manufacturer No:
    MTSW-114-10-T-Q-100
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
    MTSW-114-10-T-Q-100
  • SKU:
    2664194
  • Description:
    Flex Stack MTSW ROHS3Compliant GENERAL PURPOSE Lead Free Connector Header, Cuttable -55C~105C 3A 0.100 2.54mm

MTSW-114-10-T-Q-100 Details

Flex Stack MTSW ROHS3Compliant GENERAL PURPOSE Lead Free Connector Header, Cuttable -55C~105C 3A 0.100 2.54mm

MTSW-114-10-T-Q-100 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • Mount: Through Hole
  • JESD-609 Code: e3
  • Insulation Color: Black
  • Factory Lead Time: 3 Weeks
  • Option: GENERAL PURPOSE
  • Pitch - Mating: 0.100 2.54mm
  • Contact Length - Mating: 0.100 2.54mm
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Current Rating (Amps): 3A
  • Lead Pitch: 2.54mm
  • Shrouding: Unshrouded
  • Connector Type: Header, Cuttable
  • Insulation Material: Polyester, Glass Filled
  • Row Spacing - Mating: 0.200 (5.08mm)
  • Overall Contact Length: 0.830 21.08mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Mounting Type: Through Hole
  • Pbfree Code: yes
  • Lead Free: Lead Free
  • Termination: Solder
  • Contact Finish - Mating: Tin
  • Material Flammability Rating: UL94 V-0
  • Insulation Height: 0.100 2.54mm
  • Gender: Male
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Contact Type: Male Pin
  • Style: Board to Board or Cable
  • Operating Temperature: -55°C~105°C
  • Number of Positions: 28
  • Series: Flex Stack, MTSW
  • Contact Length - Post: 0.630 16.00mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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