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  • Manufacturer No:
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
  • SKU:
  • Description:
    Flex Stack MTSW ROHS3Compliant GENERAL PURPOSE Lead Free Connector Header, Cuttable -55C~125C 3A 10.0muin 0.25mum

MTSW-132-28-G-S-815-RA Details

Flex Stack MTSW ROHS3Compliant GENERAL PURPOSE Lead Free Connector Header, Cuttable -55C~125C 3A 10.0muin 0.25mum

MTSW-132-28-G-S-815-RA Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Mount: Through Hole
  • ECCN Code: EAR99
  • Contact Finish - Mating: Gold
  • Lead Free: Lead Free
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Material Flammability Rating: UL94 V-0
  • Gender: Male
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Current Rating (Amps): 3A
  • Contact Finish Thickness - Mating: 10.0μin 0.25μm
  • Style: Board to Board or Cable
  • HTS Code: 8536.69.40.40
  • Mounting Type: Through Hole, Right Angle
  • Connector Type: Header, Cuttable
  • Series: Flex Stack, MTSW
  • Insulation Height: 0.119 3.02mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Packaging: Bulk
  • Number of Rows: 1
  • Pbfree Code: yes
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Pitch - Mating: 0.100 2.54mm
  • JESD-609 Code: e4
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Contact Type: Male Pin
  • Lead Pitch: 2.54mm
  • Shrouding: Unshrouded
  • Contact Finish Thickness - Post: 3.00μin 0.076μm
  • Number of Positions: 32
  • Insulation Material: Polyester, Glass Filled
  • Contact Length - Post: 0.090 2.29mm
  • Contact Length - Mating: 0.815 20.70mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.


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