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  • Manufacturer No:
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Male Pins
  • Datasheet:
  • SKU:
  • Description:
    Rectangular Connector Header

MTSW-133-24-G-D-290 Details

Rectangular Connector Header

MTSW-133-24-G-D-290 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • Mount: Through Hole
  • Contact Finish - Mating: Gold
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Pitch - Mating: 0.100 2.54mm
  • Gender: Male
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Current Rating (Amps): 3A
  • Contact Type: Male Pin
  • Lead Pitch: 2.54mm
  • Row Spacing - Mating: 0.100 (2.54mm)
  • Connector Type: Header, Cuttable
  • Series: Flex Stack, MTSW
  • Number of Positions: 66
  • Overall Contact Length: 0.480 12.19mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Mounting Type: Through Hole
  • Pbfree Code: yes
  • Lead Free: Lead Free
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Material Flammability Rating: UL94 V-0
  • Insulation Height: 0.100 2.54mm
  • JESD-609 Code: e4
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Published: 2016
  • Contact Finish Thickness - Mating: 10.0μin 0.25μm
  • Style: Board to Board or Cable
  • Shrouding: Unshrouded
  • Contact Finish Thickness - Post: 3.00μin 0.076μm
  • Insulation Material: Polyester, Glass Filled
  • Contact Length - Post: 0.090 2.29mm
  • Contact Length - Mating: 0.290 7.37mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.


Based on reviews


Based on reviews

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