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SFSD-10-28-H-10.00-DR-NUS123
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SFSD-10-28-H-10.00-DR-NUS
  • Manufacturer No:
    SFSD-10-28-H-10.00-DR-NUS
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Cable Assemblies
  • Datasheet:
    SFSD-10-28-H-10.00-DR-NUS
  • SKU:
    2664252
  • Description:
    CABLE ASSY SOCKET 20POS 28AWG

SFSD-10-28-H-10.00-DR-NUS Details

CABLE ASSY SOCKET 20POS 28AWG

SFSD-10-28-H-10.00-DR-NUS Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Pbfree Code: yes
  • Contact Finish: Gold
  • Min Operating Temperature: -55°C
  • Cable Termination: Crimp
  • Shielding: Unshielded
  • Number of Positions: 20
  • Wire/Cable Type: Flat Flex
  • Max Operating Temperature: 80°C
  • Series: Tiger Eye? SFSD
  • Feature: Latch Lock, Polarizing Key
  • Current Rating: 3.7A
  • Material: Liquid Crystal Polymer
  • Connector Type B: Crimp, Socket
  • RoHS Status: ROHS3 Compliant
  • Number of Rows: 2
  • Radiation Hardening: No
  • Factory Lead Time: 3 Weeks
  • JESD-609 Code: e4
  • REACH SVHC: No SVHC
  • Contact Finish Thickness: 30.0μin 0.76μm
  • Pitch - Connector: 0.050 1.27mm
  • Connector Type: Socket to Socket
  • Color: Black, Individual
  • Voltage - Rated AC: 275V
  • Cable Length: 254mm
  • Length: 0.833' 254.00mm 10.00
  • Connector Type A: Crimp, Socket

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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