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SSQ-116-22-F-D123
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SSQ-116-22-F-D
  • Manufacturer No:
    SSQ-116-22-F-D
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Receptacles, Female Sockets
  • Datasheet:
    SSQ-116-22-F-D
  • SKU:
    2663978
  • Description:
    SSQ ROHS3Compliant GENERAL PURPOSE Lead Free Connector Receptacle -55C~125C 6.3A per Contact 465V 3.00muin 0.076mum

SSQ-116-22-F-D Details

SSQ ROHS3Compliant GENERAL PURPOSE Lead Free Connector Receptacle -55C~125C 6.3A per Contact 465V 3.00muin 0.076mum

SSQ-116-22-F-D Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • Mount: Through Hole
  • JESD-609 Code: e3
  • Lead Free: Lead Free
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Option: GENERAL PURPOSE
  • Pitch - Mating: 0.100 2.54mm
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Style: Board to Board or Cable
  • Connector Type: Receptacle
  • Contact Finish Thickness - Mating: 3.00μin 0.076μm
  • Contact Type: Forked
  • Additional Feature: TIGER BUY CONTACT
  • Voltage - Rated AC: 465V
  • Current Rating (Amps): 6.3A per Contact
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Mounting Type: Through Hole
  • Pbfree Code: yes
  • Contact Finish - Mating: Gold
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Material Flammability Rating: UL94 V-0
  • Gender: Female
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Row Spacing - Mating: 0.100 (2.54mm)
  • Number of Positions: 32
  • Insulation Height: 0.335 8.51mm
  • Voltage - Rated DC: 655V
  • Series: SSQ
  • Contact Length - Post: 0.194 4.93mm

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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