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SSW-104-22-H-S123
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SSW-104-22-H-S
  • Manufacturer No:
    SSW-104-22-H-S
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Receptacles, Female Sockets
  • Datasheet:
    SSW-104-22-H-S
  • SKU:
    2663858
  • Description:
    Rectangular Connector Receptacle

SSW-104-22-H-S Details

Rectangular Connector Receptacle

SSW-104-22-H-S Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Through Hole
  • Number of Rows: 1
  • ECCN Code: EAR99
  • Radiation Hardening: No
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Option: GENERAL PURPOSE
  • Pitch - Mating: 0.100 2.54mm
  • Gender: Female
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Reliability: COMMERCIAL
  • Style: Board to Board or Cable
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Contact Finish Thickness - Mating: 30.0μin 0.76μm
  • Contact Finish Thickness - Post: 3.00μin 0.076μm
  • Reference Standard: UL, CSA
  • Polarization Key: POLARIZED HOUSING
  • Current Rating (Amps): 5.7A per Contact
  • Body Breadth: 0.095 inch
  • Contact Length - Post: 0.194 4.93mm
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Packaging: Bulk
  • Mount: Through Hole
  • Number Of PCB Rows: 1
  • Pbfree Code: yes
  • Contact Finish - Mating: Gold
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Material Flammability Rating: UL94 V-0
  • JESD-609 Code: e4
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Number of Positions: 4
  • Number of Conductors: ONE
  • PCB Contact Pattern: RECTANGULAR
  • Subcategory: Headers and Edge Type Connectors
  • Connector Type: Receptacle
  • Plating Thickness: 30μin
  • Contact Type: Forked
  • Insulation Height: 0.335 8.51mm
  • Series: SSW
  • Body Depth: 0.335 inch

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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