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  • Manufacturer No:
    XC6SLX4-L1CSG225I
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC6SLX4-L1CSG225I
  • SKU:
    5166648
  • Description:
    CMOS 2008 ROHS3Compliant BALL FPGA -40C~100C TJ 27kB 0.46ns 1V

XC6SLX4-L1CSG225I Details

CMOS 2008 ROHS3Compliant BALL FPGA -40C~100C TJ 27kB 0.46ns 1V

XC6SLX4-L1CSG225I Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • ECCN Code: EAR99
  • Packaging: Tray
  • Qualification Status: Not Qualified
  • Peak Reflow Temperature (Cel): 260
  • Time@Peak Reflow Temperature-Max (s): 30
  • HTS Code: 8542.39.00.01
  • Terminal Pitch: 0.8mm
  • Supply Voltage: 1V
  • JESD-609 Code: e1
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Number of Outputs: 120
  • Number of Terminations: 225
  • Pin Count: 225
  • Width: 13mm
  • Number of I/O: 132
  • Number of CLBs: 300
  • Series: Spartan?-6 LX
  • RAM Size: 27kB
  • Number of Registers: 4800
  • Combinatorial Delay of a CLB-Max: 0.46 ns
  • Base Part Number: XC6SLX4
  • RoHS Status: ROHS3 Compliant
  • Mount: Surface Mount
  • Pbfree Code: yes
  • Factory Lead Time: 10 Weeks
  • Technology: CMOS
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Published: 2008
  • Terminal Position: BOTTOM
  • Terminal Form: BALL
  • Operating Supply Voltage: 1V
  • Height Seated (Max): 1.4mm
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Subcategory: Field Programmable Gate Arrays
  • Number of Pins: 225
  • Length: 13mm
  • Operating Temperature: -40°C~100°C TJ
  • Number of LABs/CLBs: 300
  • Voltage - Supply: 1.14V~1.26V
  • Number of Logic Elements/Cells: 3840
  • Total RAM Bits: 221184
  • Power Supplies: 12.5/3.3V
  • Package / Case: 225-LFBGA, CSPBGA

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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