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  • Manufacturer No:
  • Manufacturer:
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
  • SKU:
  • Description:
    Contains Lead CMOS 1999 Non-RoHS Compliant FPGA -40C~100C TJ 784B 1.6ns 125MHz

XC4005E-2PQ100I Details

Contains Lead CMOS 1999 Non-RoHS Compliant FPGA -40C~100C TJ 784B 1.6ns 125MHz

XC4005E-2PQ100I Specification Parameters

  • Mounting Type: Surface Mount
  • RoHS Status: Non-RoHS Compliant
  • Supply Voltage: 5V
  • Packaging: Tray
  • Lead Free: Contains Lead
  • JESD-609 Code: e0
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Position: QUAD
  • Number of Terminations: 100
  • Pin Count: 100
  • Voltage - Supply: 4.5V~5.5V
  • Length: 20mm
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Peak Reflow Temperature (Cel): 225
  • Terminal Finish: Tin/Lead (Sn85Pb15)
  • Operating Temperature: -40°C~100°C TJ
  • Number of Gates: 5000
  • Number of Equivalent Gates: 3000
  • Number of LABs/CLBs: 196
  • Number of Logic Cells: 196
  • Combinatorial Delay of a CLB-Max: 1.6 ns
  • Number of Logic Elements/Cells: 466
  • Base Part Number: XC4005E
  • Mount: Surface Mount
  • Part Status: Obsolete
  • Power Supplies: 5V
  • Pbfree Code: no
  • Qualification Status: Not Qualified
  • Terminal Form: GULL WING
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Reach Compliance Code: not_compliant
  • HTS Code: 8542.39.00.01
  • Number of Pins: 100
  • Terminal Pitch: 0.65mm
  • Width: 14mm
  • Published: 1999
  • Subcategory: Field Programmable Gate Arrays
  • Clock Frequency: 125MHz
  • Height Seated (Max): 3.4mm
  • Number of Outputs: 112
  • Package / Case: 100-BQFP
  • Number of I/O: 77
  • Number of CLBs: 196
  • Series: XC4000E/X
  • Total RAM Bits: 6272
  • RAM Size: 784B

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.


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