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  • Manufacturer No:
  • Manufacturer:
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
  • SKU:
  • Description:
    Contains Lead CMOS 1999 Non-RoHS Compliant FPGA -40C~100C TJ 12.3kB 1.3ns 200MHz

XC4085XL-1BG560I Details

Contains Lead CMOS 1999 Non-RoHS Compliant FPGA -40C~100C TJ 12.3kB 1.3ns 200MHz

XC4085XL-1BG560I Specification Parameters

  • Mounting Type: Surface Mount
  • RoHS Status: Non-RoHS Compliant
  • Supply Voltage: 3.3V
  • Packaging: Tray
  • Qualification Status: Not Qualified
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Pitch: 1.27mm
  • Terminal Position: BOTTOM
  • Published: 1999
  • Clock Frequency: 200MHz
  • Subcategory: Field Programmable Gate Arrays
  • Terminal Finish: Tin/Lead (Sn63Pb37)
  • Operating Temperature: -40°C~100°C TJ
  • Width: 42.5mm
  • Number of Terminations: 560
  • Combinatorial Delay of a CLB-Max: 1.3 ns
  • Number of Outputs: 448
  • Number of Gates: 85000
  • Package / Case: 560-LBGA Exposed Pad, Metal
  • Number of Equivalent Gates: 55000
  • Number of Logic Elements/Cells: 7448
  • Base Part Number: XC4085XL
  • Mount: Surface Mount
  • Part Status: Obsolete
  • Power Supplies: 3.3V
  • Lead Free: Contains Lead
  • JESD-609 Code: e0
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Reach Compliance Code: not_compliant
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • Voltage - Supply: 3V~3.6V
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Peak Reflow Temperature (Cel): 225
  • Height Seated (Max): 1.7mm
  • Length: 42.5mm
  • Series: XC4000E/X
  • Pin Count: 560
  • Number of I/O: 448
  • Number of Inputs: 448
  • Number of LABs/CLBs: 3136
  • JESD-30 Code: S-PBGA-B560
  • Total RAM Bits: 100352
  • RAM Size: 12.3kB

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.


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