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  • Manufacturer No:
  • Manufacturer:
  • Category:
    Embedded - CPLDs (Complex Programmable Logic Devices)
  • Datasheet:
  • SKU:
  • Description:
    YES 208-BFQFP 1996 CoolRunner XPLA3 complex programmable logic device 97MHz 28mm 9ns 3V~3.6V

XCR3512XL-10PQ208C Details

YES 208-BFQFP 1996 CoolRunner XPLA3 complex programmable logic device 97MHz 28mm 9ns 3V~3.6V

XCR3512XL-10PQ208C Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • RoHS Status: Non-RoHS Compliant
  • Supply Voltage: 3.3V
  • Pbfree Code: no
  • Qualification Status: Not Qualified
  • Terminal Form: GULL WING
  • Speed Grade: 10
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Pitch: 0.5mm
  • HTS Code: 8542.39.00.01
  • Operating Temperature: 0°C~70°C TA
  • Peak Reflow Temperature (Cel): 225
  • Terminal Finish: Tin/Lead (Sn85Pb15)
  • Width: 28mm
  • Number of Terminations: 208
  • Pin Count: 208
  • Published: 1996
  • Subcategory: Programmable Logic Devices
  • Number of Macro Cells: 512
  • Delay Time tpd(1) Max: 9ns
  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Max Frequency: 97MHz
  • Packaging: Bulk
  • ECCN Code: EAR99
  • Surface Mount: YES
  • Additional Feature: YES
  • Operating Supply Voltage: 3.3V
  • Factory Lead Time: 10 Weeks
  • JESD-609 Code: e0
  • Technology: CMOS
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Number of Logic Elements/Blocks: 32
  • Terminal Position: QUAD
  • Supply Voltage-Max (Vsup): 3.6V
  • Voltage Supply - Internal: 3V~3.6V
  • Memory Type: EEPROM
  • Length: 28mm
  • Propagation Delay: 10 ns
  • Number of Pins: 208
  • Output Function: MACROCELL
  • Height Seated (Max): 4.1mm
  • Number of I/O: 180
  • Package / Case: 208-BFQFP
  • Number of Gates: 12000
  • Series: CoolRunner XPLA3

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.


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