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  • Manufacturer No:
    ATFC-0402-2N0B
  • Manufacturer:
  • Category:
    Fixed Inductors
  • Datasheet:
  • SKU:
    10676311
  • Description:
    GENERAL PURPOSE INDUCTOR RoHS Compliant WRAPAROUND DUAL ENDED fixed air core inductor -45C 8GHz 0.35Ohm 2nH
  • Quantity:
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Inventory:342
  • Qty Unit Price price
  • 1 $0.108 $0.108
  • 10 $0.106 $1.06
  • 100 $0.104 $10.4
  • 1000 $0.102 $102
  • 10000 $0.1 $1000

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  • Manufacturer No:
    ATFC-0402-2N0B
  • Manufacturer:
    Xilinx
  • Category:
    Fixed Inductors
  • Datasheet:
    ATFC-0402-2N0B
  • SKU:
    10676311
  • Description:
    GENERAL PURPOSE INDUCTOR RoHS Compliant WRAPAROUND DUAL ENDED fixed air core inductor -45C 8GHz 0.35Ohm 2nH

ATFC-0402-2N0B Details

GENERAL PURPOSE INDUCTOR RoHS Compliant WRAPAROUND DUAL ENDED fixed air core inductor -45C 8GHz 0.35Ohm 2nH

ATFC-0402-2N0B Specification Parameters

  • Shielding: NO
  • Number of Functions: 1
  • Surface Mount: YES
  • Terminal Shape: WRAPAROUND
  • Core Material: Ceramic
  • Shape/Size Description: RECTANGULAR PACKAGE
  • Construction: Chip
  • Q Factor: 13
  • Inductor Application: RF INDUCTOR
  • Test Frequency: 500MHz
  • Operating Temperature (Min): -45°C
  • Terminal Finish: Matte Tin (Sn) - reflowed over Nickel (Ni) barrier
  • Rated Current-Max: 0.56A
  • Special Feature: INDUCTANCE TOLERANCE IS 0.1,0.2,0.3 NANOHENRY, Q MEASURED AT 500MHZ
  • Number of Terminations: 2
  • RoHS Status: RoHS Compliant
  • JESD-609 Code: e3
  • Operating Temperature (Max): 85°C
  • Tolerance: 5%
  • Case/Size Code: 0402
  • Quality Factor-Min (at L-nom): 13
  • Terminal Placement: DUAL ENDED
  • Inductor Type: GENERAL PURPOSE INDUCTOR
  • Packing Method: TAPE, PAPER
  • Frequency - Self Resonant: 8GHz
  • DC Resistance (DCR): 0.35Ohm
  • Inductance: 2 nH
  • Inductance-Nom (L): 0.002 μH

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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