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  • Manufacturer No:
    MMBZ5225BS-7-F
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Diodes - Zener - Single
  • Datasheet:
    MMBZ5225BS-7-F
  • SKU:
    10803434
  • Description:
    DIODE ZENER ARRAY 3V SOT363

MMBZ5225BS-7-F Details

DIODE ZENER ARRAY 3V SOT363

MMBZ5225BS-7-F Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • Radiation Hardening: No
  • Lead Free: Lead Free
  • Number of Terminations: 6
  • Pin Count: 6
  • Peak Reflow Temperature (Cel): 260
  • Terminal Finish: Matte Tin (Sn)
  • Reference Voltage: 3V
  • Zener Voltage: 3V
  • Tolerance: 5%
  • Voltage Tolerance: 5%
  • Factory Lead Time: 11 Weeks
  • Height: 1mm
  • Reverse Test Voltage: 1V
  • Max Power Dissipation: 200mW
  • Polarity: UNIDIRECTIONAL
  • HTS Code: 8541.10.00.50
  • Max Reverse Leakage Current: 50μA
  • Forward Voltage-Max: 0.9V
  • Width: 1.35mm
  • Configuration: SEPARATE, 2 ELEMENTS
  • Package / Case: SOT-363
  • RoHS Status: ROHS3 Compliant
  • Number of Elements: 2
  • Packaging: Tape & Reel (TR)
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Terminal Position: DUAL
  • Number of Pins: 6
  • Terminal Form: GULL WING
  • Min Operating Temperature: -65°C
  • Time@Peak Reflow Temperature-Max (s): 40
  • Voltage - Rated DC: 3V
  • Max Operating Temperature: 150°C
  • Voltage Tol-Max: 5%
  • Published: 2007
  • Diode Element Material: SILICON
  • Test Current: 20mA
  • Power Rating: 200mW
  • Power Dissipation: 200mW
  • Diode Type: ZENER DIODE
  • Technology: ZENER
  • Peak Reverse Current: 50μA
  • Length: 2.2mm
  • Weight: 6.010099mg
  • Subcategory: Other Diodes
  • Impedance: 30 Ω

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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