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  • Manufacturer No:
    MC68030FE16C
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Embedded - Microprocessors
  • Datasheet:
    MC68030FE16C
  • SKU:
    10861958
  • Description:
    FIXED POINT MICROPROCESSOR RISC GULL WING IC Microprocessor 70C 0.635mm 5V 32b

MC68030FE16C Details

FIXED POINT MICROPROCESSOR RISC GULL WING IC Microprocessor 70C 0.635mm 5V 32b

MC68030FE16C Specification Parameters

  • Boundary Scan: NO
  • Moisture Sensitivity Level (MSL): 1
  • RoHS Status: RoHS Compliant
  • Integrated Cache: YES
  • Supply Voltage: 5V
  • Temperature Grade: COMMERCIAL
  • Qualification Status: Not Qualified
  • Peak Reflow Temperature (Cel): 260
  • Max Operating Temperature: 70°C
  • Bit Size: 32
  • Terminal Position: QUAD
  • Technology: HCMOS
  • Terminal Pitch: 0.635mm
  • Frequency: 166MHz
  • Number of Pins: 132
  • Format: FIXED POINT
  • Core Architecture: RISC
  • Weight: 5.821943g
  • Low Power Mode: NO
  • Number of Cores: 1
  • Surface Mount: YES
  • JESD-609 Code: e3
  • Operating Supply Voltage: 5V
  • Lead Free: Contains Lead
  • Terminal Form: GULL WING
  • Terminal Finish: Matte Tin (Sn)
  • Time@Peak Reflow Temperature-Max (s): 40
  • Address Bus Width: 32
  • Min Operating Temperature: 0°C
  • Frequency (Max): 16MHz
  • Data Bus Width: 32b
  • Number of Terminations: 132
  • Pin Count: 132
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR
  • Additional Feature: DYNAMIC BUS SIZING;UPTO 9.2 MIPS

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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