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  • Manufacturer No:
    MC68EN360EM25VL
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Embedded - Microprocessors
  • Datasheet:
    MC68EN360EM25VL
  • SKU:
    10897761
  • Description:
    Contains Lead MICROCONTROLLER RISC Not Qualified GULL WING IC Microprocessor 70C 0.5mm 2.7V 25MHz

MC68EN360EM25VL Details

Contains Lead MICROCONTROLLER RISC Not Qualified GULL WING IC Microprocessor 70C 0.5mm 2.7V 25MHz

MC68EN360EM25VL Specification Parameters

  • DAC Channels: NO
  • PWM Channels: NO
  • Number of Cores: 1
  • ECCN Code: EAR99
  • DMA Channels: YES
  • Moisture Sensitivity Level (MSL): 3
  • Lead Free: Contains Lead
  • JESD-609 Code: e0
  • Max Operating Temperature: 70°C
  • Supply Voltage: 3V
  • External Data Bus Width: 32
  • Terminal Pitch: 0.5mm
  • Supply Voltage-Min (Vsup): 2.7V
  • Number of Pins: 240
  • Pin Count: 240
  • uPs/uCs/Peripheral ICs Type: MICROCONTROLLER, RISC
  • Peak Reflow Temperature (Cel): 220
  • Additional Feature: ALSO OPERATES AT 3.3 V
  • Has ADC: NO
  • Packaging: Bulk
  • RoHS Status: RoHS Compliant
  • Surface Mount: YES
  • Supply Voltage-Max (Vsup): 3.3V
  • Temperature Grade: COMMERCIAL
  • Qualification Status: Not Qualified
  • Terminal Form: GULL WING
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • Address Bus Width: 32
  • Terminal Position: QUAD
  • Min Operating Temperature: 0°C
  • Number of Terminations: 240
  • Frequency: 25MHz
  • Technology: HCMOS
  • Halogen Free: Not Halogen Free

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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