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- Manufacturer No：MPC8535EAVTAKG
- Manufacturer：
- Category：Embedded - Microprocessors
- Datasheet：
- SKU：10898505
- Description：FLOATING POINT MICROPROCESSOR BOTTOM BALL IC Microprocessor 90C 29mm 0.95V 32b
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- Manufacturer No：MPC8535EAVTAKG
- Manufacturer：Freescale Semiconductor, Inc. (NXP Semiconductors)
- Category：Embedded - Microprocessors
- Datasheet：MPC8535EAVTAKG
- SKU：10898505
- Description：FLOATING POINT MICROPROCESSOR BOTTOM BALL IC Microprocessor 90C 29mm 0.95V 32b
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MPC8535EAVTAKG Details
FLOATING POINT MICROPROCESSOR BOTTOM BALL IC Microprocessor 90C 29mm 0.95V 32b
MPC8535EAVTAKG Specification Parameters
- Number of Cores: 1
- Radiation Hardening: No
- Low Power Mode: YES
- Integrated Cache: YES
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 40
- Address Bus Width: 32
- Min Operating Temperature: 0°C
- Supply Voltage: 1V
- Temperature Grade: OTHER
- Max Operating Temperature: 90°C
- Supply Voltage-Min (Vsup): 0.95V
- Frequency (Max): 600MHz
- Height Seated (Max): 2.76mm
- Package / Case: FCBGA
- uPs/uCs/Peripheral ICs Type: MICROPROCESSOR
- Pin Count: 783
- JESD-30 Code: S-PBGA-B783
- Weight: 3.695587g
- RoHS Status: RoHS Compliant
- Surface Mount: YES
- Boundary Scan: YES
- Moisture Sensitivity Level (MSL): 3
- Peak Reflow Temperature (Cel): 260
- Bit Size: 32
- Terminal Position: BOTTOM
- Terminal Form: BALL
- Halogen Free: Halogen Free
- Data Bus Width: 32b
- Length: 29mm
- Frequency: 600MHz
- Subcategory: Microprocessors
- Format: FLOATING POINT
- JESD-609 Code: e3/e4
- Number of Terminations: 783
- Terminal Finish: TIN/SILVER
- ECCN Code: 5A002
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Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction
Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.
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