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  • Manufacturer No:
    MC68882FN25A
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Embedded - Microprocessors
  • Datasheet:
    MC68882FN25A
  • SKU:
    10919347
  • Description:
    Contains Lead MATH PROCESSOR COPROCESSOR MC68020; MC68030 J BEND IC Microprocessor 25mus 70C 150mA 24.2062mm

MC68882FN25A Details

Contains Lead MATH PROCESSOR COPROCESSOR MC68020; MC68030 J BEND IC Microprocessor 25mus 70C 150mA 24.2062mm

MC68882FN25A Specification Parameters

  • Boundary Scan: NO
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • Power Supplies: 5V
  • Temperature Grade: COMMERCIAL
  • Qualification Status: Not Qualified
  • Address Bus Width: 5
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Pitch: 1.27mm
  • Terminal Position: QUAD
  • Height Seated (Max): 4.57mm
  • Supply Current-Max: 150mA
  • Pin Count: 68
  • HTS Code: 8542.31.00.01
  • Supply Voltage-Min (Vsup): 4.75V
  • Access Time: 25 μs
  • JESD-30 Code: S-PQCC-J68
  • Width: 24.2062mm
  • uPs/uCs/Peripheral ICs Type: MATH PROCESSOR, COPROCESSOR
  • Packaging: Bulk
  • RoHS Status: RoHS Compliant
  • Supply Voltage: 5V
  • Moisture Sensitivity Level (MSL): 3
  • Lead Free: Contains Lead
  • JESD-609 Code: e0
  • Operating Temperature (Max): 70°C
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • External Data Bus Width: 32
  • Terminal Form: J BEND
  • Frequency: 25MHz
  • Number of Terminations: 68
  • Supply Voltage-Max (Vsup): 5.25V
  • Technology: HCMOS
  • Peak Reflow Temperature (Cel): 220
  • Package / Case: LCC
  • Length: 24.2062mm
  • Subcategory: Math Processors
  • Bus Compatibility: MC68020; MC68030

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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