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- Manufacturer No：MC68MH360ZP25VL
- Manufacturer：Freescale Semiconductor, Inc. (NXP Semiconductors)
- Category：Embedded - Microprocessors
- Datasheet：MC68MH360ZP25VL
- SKU：10930089
- Description：Contains Lead SERIAL IO/COMMUNICATION CONTROLLER LAN 68000 BALL IC Microprocessor 70C 25mm 2.7V 25MHz
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MC68MH360ZP25VL Details
Contains Lead SERIAL IO/COMMUNICATION CONTROLLER LAN 68000 BALL IC Microprocessor 70C 25mm 2.7V 25MHz
MC68MH360ZP25VL Specification Parameters
- Packaging: Bulk
- ECCN Code: EAR99
- Surface Mount: YES
- Boundary Scan: YES
- Supply Voltage-Max (Vsup): 3.3V
- Temperature Grade: COMMERCIAL
- Qualification Status: Not Qualified
- Max Operating Temperature: 70°C
- Supply Voltage: 3V
- External Data Bus Width: 32
- Terminal Position: BOTTOM
- Min Operating Temperature: 0°C
- Terminal Finish: TIN LEAD
- Length: 25mm
- Technology: HCMOS
- Package / Case: BGA
- Number of Terminations: 357
- uPs/uCs/Peripheral ICs Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN
- Communication Protocol: ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC
- Number of Cores: 1
- RoHS Status: Non-RoHS Compliant
- Low Power Mode: YES
- Number of Serial I/Os: 4
- Moisture Sensitivity Level (MSL): 3
- Lead Free: Contains Lead
- JESD-609 Code: e0
- Time@Peak Reflow Temperature-Max (s): 30
- Reach Compliance Code: not_compliant
- Address Bus Width: 32
- Supply Voltage-Min (Vsup): 2.7V
- Terminal Form: BALL
- Frequency: 25MHz
- Width: 25mm
- Peak Reflow Temperature (Cel): 220
- Halogen Free: Not Halogen Free
- Pin Count: 357
- Bus Compatibility: 68000
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Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction
Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.
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