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- Manufacturer No：MC88915TFN160
- Manufacturer：Freescale Semiconductor, Inc. (NXP Semiconductors)
- Category：Clock/Timing - Clock Generators, PLLs, Frequency Synthesizers
- Datasheet：MC88915TFN160
- SKU：10938375
- Description：QUAD J BEND COMMERCIAL CMOS (Type) IC 0C 0.75ns 4.57mm 0.036A
User Guide
User Guide
MC88915TFN160 Details
QUAD J BEND COMMERCIAL CMOS (Type) IC 0C 0.75ns 4.57mm 0.036A
MC88915TFN160 Specification Parameters
- Packaging: Bulk
- Number of Functions: 1
- Moisture Sensitivity Level (MSL): 1
- RoHS Status: Non-RoHS Compliant
- Supply Voltage: 5V
- Temperature Grade: COMMERCIAL
- PLL: Yes
- Qualification Status: Not Qualified
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Finish: Tin/Lead (Sn/Pb)
- Pin Count: 28
- Min Operating Temperature: 0°C
- Height Seated (Max): 4.57mm
- Supply Voltage-Max (Vsup): 5.25V
- Input: TTL
- Frequency: 160MHz
- Subcategory: Clock Drivers
- Package / Case: LCC
- Max I(ol): 0.036 A
- Mount: Surface Mount
- Number of Circuits: 1
- Number of Inverted Outputs: 1
- Number of Outputs: 8
- Power Supplies: 5V
- Pbfree Code: no
- Lead Free: Contains Lead
- JESD-609 Code: e0
- Max Operating Temperature: 70°C
- Reach Compliance Code: not_compliant
- Number of Terminations: 28
- Terminal Position: QUAD
- Terminal Form: J BEND
- Output Characteristics: 3-STATE
- Supply Voltage-Min (Vsup): 4.75V
- Peak Reflow Temperature (Cel): 220
- Frequency (Max): 160MHz
- Logic IC Type: PLL BASED CLOCK DRIVER
- Same Edge Skew-Max (tskwd): 0.75 ns
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Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction
Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.
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