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  • Manufacturer No:
    MC68LC302PU25CT
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Embedded - Microprocessors
  • Datasheet:
    MC68LC302PU25CT
  • SKU:
    10942944
  • Description:
    Contains Lead SERIAL IO/COMMUNICATION CONTROLLER LAN 68000 GULL WING IC Microprocessor 70C 0.5mm 5V 68kB

MC68LC302PU25CT Details

Contains Lead SERIAL IO/COMMUNICATION CONTROLLER LAN 68000 GULL WING IC Microprocessor 70C 0.5mm 5V 68kB

MC68LC302PU25CT Specification Parameters

  • Low Power Mode: NO
  • Number of Cores: 1
  • ECCN Code: EAR99
  • Boundary Scan: YES
  • Number of Serial I/Os: 4
  • Lead Free: Contains Lead
  • Terminal Form: GULL WING
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Pitch: 0.5mm
  • Number of Terminations: 100
  • Pin Count: 100
  • Frequency: 25MHz
  • Technology: HCMOS
  • Peak Reflow Temperature (Cel): 220
  • Halogen Free: Not Halogen Free
  • uPs/uCs/Peripheral ICs Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN
  • RAM Size: 1.1kB
  • Packaging: Bulk
  • RoHS Status: RoHS Compliant
  • Surface Mount: YES
  • Operating Supply Voltage: 5V
  • Moisture Sensitivity Level (MSL): 3
  • Qualification Status: Not Qualified
  • Max Operating Temperature: 70°C
  • Address Bus Width: 24
  • Terminal Position: QUAD
  • Number of Pins: 100
  • Min Operating Temperature: 0°C
  • Frequency (Max): 25MHz
  • Data Bus Width: 32b
  • Package / Case: LQFP
  • Interface: Parallel, Serial
  • Bus Compatibility: 68000
  • Memory Size: 68kB

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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